This automotive-compliant multi-phase SPI boost controller is designed to meet the power density, efficiency, EMI, and ...

SemiQ, a US developer of SiC solutions, has launched the QSiC Dual3, a family of 1200 V half-bridge MOSFET modules for motor ...

First-of-its-kind bidirectional GaN technology with DC blocking dramatically reduces switch count needed for power conversion ...

Toshiba Electronics Europe has expanded its DTMOSVI 600V portfolio with a new line of N‑channel power MOSFETs.

Apex Microtechnology has announced the release of the MSA303, the latest member to its family of integrated power modules. The module utilizes silicon carbide MOSFET technology to improve efficiency ...

Toshiba Electronics Europe GmbH has added the DTMOSVI 600V HSD (High-Speed Diode) N-channel power MOSFETs to the DTMOSVI 600V Series, featuring a super junction structure. The seven new products are ...

Microchip Technology has announced its BZPACK mSiC® power modules, designed to meet stringent High Humidity High Voltage High ...

According to the latest study published by MarkNtel Advisors, the Global Silicon Carbide Market is projected to grow at a CAGR of around 27.12% during ...

The BZPACK mSiC power modules leverage Microchip’s advanced mSiC technology, incorporating performance of its MB and MC SiC ...

A power device could change how high voltage systems are designed by simplifying architectures, reducing cost and replacing ...

ROHM Semiconductor U.S.A., LLC today announced its participation at APEC 2026, the premier event for the power ...

A module changes how power systems work, cuts heat, stops faults fast, and keeps backup power running in parallel and ...