IEEE Spectrum on MSN
Self-healing imager could withstand Jupiter’s radiation belt
A radiation-hardened camera chip heals itself pixel by pixel ...
CEA-Leti and Fraunhofer IPMS have successfully completed the first exchange of ferroelectric memory wafers within the FAMES Pilot Line, marking a pivotal milestone in establishing a shared European ...
The global CMOS image sensor (CIS) supply chain faces a major disruption as HiSilicon, core semiconductor subsidiary, ...
The global semiconductor foundry industry is set for robust expansion in 2026, driven by accelerating investments in ...
SEEQC today announced a significant breakthrough in the development of scalable, chip-based quantum computers, with results published in a peer-reviewed study in Nature Electronics. The publication ...
The Sony IMX820 CMOS sensor features a chip on wafer (COW) architecture, which saves on production costs and bolsters camera ...
The initiative is to focus on design automation and architecture research for future chips. The consortium will benefit from ...
A collaborative team of researchers from MediaTek, Microsoft Research, and other suppliers have successfully designed a ...
Imec has launched consortium with 26 European university groups that will work on the technology roadmap beyond CMOS scaling (CMOS 2.0). This initiative will focus on design automation and chip ...
More and more powerful AI chips are needed for increasingly complex AI applications. Aiming to boost Germany’s innovative strength in this cutting-edge technology in Heilbronn, the Fraunhofer ...
Sony's core semiconductor business, CMOS image sensors (CIS), has reportedly encountered yield challenges in recent ...
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