Nvidia has announced that it is to invest $5 billion in Intel, becoming one of the tech giant's largest shareholders.

Nexperia has unveiled AEC-Q101 qualified 100 V MOSFETs, in a compact CCPAK1212 (12 x 12 mm) copper-clip packaging.

Siemens Digital Industries Software has introduced Tessent AnalogTest software – a solution that looks to reduce pattern ...

Microchip Technology has unveiled a new family of DualPack 3 (DP3) power modules featuring advanced IGBT7 technology.

Grinn, a specialist in the design of advanced IoT and embedded solutions, signs a strategic partnership with MediaTek.

Nordic's new nRF54LM20A is the latest addition to its next-generation nRF54L series of ultra-low power wireless SoCs.

TI's C2000 real-time MCUs designed to help engineers design consumer products with improved levels of performance.

ST looks to advance next-generation chip manufacturing technology with new PLP pilot line at its facility in Tours.

The UK and the US agree technology pact that looks to boost ties in AI, quantum computing and civil nuclear power.

Mill-Max has developed low-force spring alternatives for our high reliability spring-loaded pins, providing off-the-shelf ...

Ambient Scientific has launched the GPX10 Pro, an SoC that enables AI inference on battery-powered edge devices.

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