NVIDIA has unveiled its next AI platform, Vera Rubin, designed for the next phase of artificial intelligence: reasoning, ...
Among the big five hyperscalers, an estimated $720 billion will be spent on AI capex this year. While chip designers are the ...
Researchers developed a super tiny thermometer that sits directly on a chip could monitor temperature changes and potentially improve processor performance.
Nvidia's next-but-one AI accelerator Feynman will be much smaller. Instead of side-by-side chips, they will be stacked from 2028.
Micrometre-scale sensors embedded in chips enable ultrafast, real-time monitoring of processor temperatures to improve thermal management in advanced electronics.
Cadence, Dassault Systèmes, Siemens and Synopsys are building NVIDIA-powered AI agents to plan, optimize and verify complex chip and system workflows.
EPC claims its seventh-generation, 40-V power transistor delivers up to 3X better performance than equivalent silicon MOSFETs.
Company will participate and present at APEC 2026, highlighting recent advancements in its power management platform for AI processor power delivery and emerging high-current applications ...
As Apple approaches its annual iPhone launch season, new leaks suggest the company’s first foldable device could arrive with powerful hardware and the highest price tag ever seen on an iPhone.
Jensen Huang raises revenue forecast to $1 trillion, launches Vera Rubin, Groq 3 LPU, NemoClaw, and DLSS 5. Full analysis and ...