A modern approach applies artificial intelligence to accident reconstruction by mining large-scale accident databases ...

TSMC's 2 nm technology is the first to adopt nanosheet transistor structure, and N2P represents the next evolution in the 2 nm family, set to deliver improved performance and power efficiency. The ...

TSMC brings decades of experience in 12-inch wafer production. Its existing infrastructure, process control, and packaging expertise allow it to treat SiC not just as a material upgrade, but as part ...

The OPEN Alliance is a global industry initiative committed to establishing Ethernet as the universal standard for in-vehicle networks. By complying with this standard, Comcores’ MACsec IP empowers ...

SMIC is testing a deep-ultraviolet lithography machine made by Shanghai-based start-up Yuliangsheng, the FT reported, citing two people with knowledge of the development. DUV machines are a key ...

AI and high-performance computing (HPC) workloads are growing steadily, and the need for establishing high performance and low-latency interconnect links is placing pressure on interconnect technology ...

Canadian AI company Cohere has officially opened a new office in Paris, establishing the city as its central hub for fast-growing operations across Europe, the Middle East and Africa (EMEA). The move ...

RISC-V is the open industry standard Instruction Set Architecture (ISA), bringing new possibilities for innovation to automotive. An ISA is the interface between hardware and software, and the open ...

Galitzky most recently served as Vice President, Surface Devices and Accessories at Microsoft, where he helped define Microsoft’s edge AI roadmap for consumer devices and its integration into ...

D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitation.

The alliance with GF further strengthens Sofics’ position as a leading enabler of cost-efficient, high-performance IC design. Sofics’ IP has been deployed in more than 5000 IC designs, covering ...

Qualitas Semiconductor will next participate in ICCAD 2025 in Chengdu, China, on November 20–21, where it will unveil its PCIe Gen 6.0 PHY IP for the first time. During the exhibition, Qualitas will ...