Background: Glass, 45, has lived in the Chicago area all his life. He has a bachelor`s degree from the Institute of Design at the Illinois Institute of Technology and an MBA in marketing and business ...

In his San Francisco studio, package designer Primo Angeli explains that "there is a relationship between consumers and packages, a psychodrama, really." Indeed, packages are "silent salesmen" that ...

As system-on-chip designs migrate to nanometer silicon, packaging technology is challenged to keep pace with the integration and performance capabilities offered. Nowhere is this more so than in ...

Targeting a silicon device for a flip-chip package introduces significant IC and package design complexities throughout the entire product development cycle. This package-die combination must be ...

Chip design companies and package assembly houses have no unified signoff verification process to ensure that an IC package meets manufacturability and performance requirements. Packages need a ...