At the heart of advancing semiconductor chip technology lies a critical challenge: creating smaller, more efficient electronic components. This challenge is particularly evident in the field of ...

Japanese chipmaker Rapidus discloses one more aspect of its strategy: to offer lower quotes than TSMC.

A technical paper titled “Review of virtual wafer process modeling and metrology for advanced technology development” was published by researchers at Coventor Inc., Lam Research. “Semiconductor logic ...

In an update to its International Technology Roadmap for Photovoltaics, German engineering association the VDMA notes standardization of wafer size is a topic of great interest to the country’s PV ...

NexWafe’s EpiNex solar wafers achieved 24.4% efficiency on a commercial M6 heterojunction (HJT) cell line, for the first time delivering performance parity with conventional CZ wafers. Modules made ...

US-Based wafer producer 1366 Technologies and ‘Silicon Module Super League’ (SMSL) member Hanwha Q CELLS have jointly hit a new record of 19.6% efficiency for cells using 1366's 'Direct wafer' process ...

The elimination of sawing kerf loss combined with its ability to make thinner wafers of high quality make the implant-cleave wafering approach technically and economically attractive. For example, ...

U.S. based PV innovator 1366 Technologies, and Korean PV manufacturer Hanwha Q CELLS have announced a new performance record for cells produced using 1366’s Direct Wafer technique. The cells achieved ...

BEDFORD, Mass. & SEOUL, South Korea--(BUSINESS WIRE)--Silicon wafer manufacturer 1366 Technologies together with its strategic partners, Hanwha Q CELLS Malaysia Sdn. Bhd. and parent company Hanwha Q ...

Intel reportedly solves one of the key issues that plagued its 18A process technology, but others may still be there.