Typical 3D thermal simulation of electronics components assumes that all the power consumption the data sheets define is dissipated in the semiconductor. In the case of high current power modules, ...
A new technical paper titled “DeepOHeat-v1: Efficient Operator Learning for Fast and Trustworthy Thermal Simulation and Optimization in 3D-IC Design” was published by researchers at Intel Corporation, ...
Joule heating, also known as resistive or Ohmic heating, is the power lost to heat as electrical current flows down a conductor. We were introduced to Joule’s first law (Power dissipation = I²R, VI, ...
Air conditioning is essential for new cars. But the fluorocarbon refrigerant HFC-134a — the global standard — is considered an ozone-depleting substance and the European Union passed regulations ...
Santa Clara, CA and Kyoto, Japan, Dec. 07, 2021 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the recent addition of a new thermal analysis function to the ROHM Solution Simulator. This new ...
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