The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...
Penguin Solutions, Inc. (Nasdaq: PENG) a provider of high-performance computing and AI infrastructure solutions, today - Read ...
Samsung last month unveiled a SOCAMM2 LPDDR5-based memory module designed specifically for AI data center platforms.
SAN JOSE, Calif.--(BUSINESS WIRE)--Today at Memcon 2024, Samsung Electronics, a world leader in advanced semiconductor technology, unveiled the expansion of its Compute Express Link (CXL) memory ...
SK hynix showcases its next-gen memory solutions for AI at CES 2026: with 48GB HBM4, SOCAMM, LPDDR6, and more for future AI ...
Last year saw the emergence of a new memory module standard called CAMM2, a flat alternative to the SO-DIMM sticks used widely in laptops today. The benefits of CAMM are clear: they're thinner than SO ...
Samsung has just announced it has made the world's first 512GB DDR5 memory module, using High-K Metal Gate (HKMG) process technology. We have 7200Mbps speed here with the DDR5 module, double the ...
Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of a new-generation smart robotic computing module, the SH602HA-AP. Based on the D-Robotics Sunrise ...
Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of a new-generation smart ...
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