Applied Materials’ new Endura® Copper Barrier Seed IMS™ combines seven different process technologies in one system under high vacuum to improve chip performance and power consumption. An animation of ...
Researchers have built logic circuits, the heart of all electronic gadgets, on molybdenum disulfide films that are two molecular layers thick (Nano Lett., DOI: 10.1021/nl302015v). The devices are the ...
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