Embedded finance is usually what we hear about when brands and non-financial businesses want to offer financial products or services — like banking, insurance, lending and payments — to provide a ...
Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...
Advanced AI and machine learning capabilities transform tax compliance into a business advantage across global mandates Sovos, the always-on tax compliance company, today announced the launch of Sovi™ ...
The LPC11C22 and LPC11C24 from NXP are integrated high-speed CAN physical layer transceiver and microcontroller with on-chip CANopen drivers. The system-in-package solution with integrated TJF1051 CAN ...
SAN FRANCISCO, July 09, 2025 (GLOBE NEWSWIRE) -- Layer, the leading embedded accounting platform for small and medium-size business (SMB) software, today announced it has raised $6.6 million in seed ...
1. These chips from Micron implement the Universal Flash Storage (UFS) 2.1 standard and use Micronâ s 3D NAND flash memory technology. Last month's Flash Memory Summit was host to a flurry of new ...
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