The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.
Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...
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The inspection rule that applies even to 'minor' electrical updates
Even the smallest electrical tweak can trigger the same safety rules that govern a full panel upgrade, and ignoring that ...
CyberOptics utilized deep learning to accurately inspect the corner fill on integrated circuits (ICs) produced by a large memory supplier. Traditional methods of inspection showed limitations in their ...
The areas of semiconductor test, inspection, and related technologies have seen considerable innovation during the second half of 2017. With regard to test, traditional ATE companies introducing new ...
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