Based CPU-GPU Architecture with Replay-Driven Simulation and Emulation,” was published by researchers at Intel, Nvidia and ...

HyperLight Corporation ("HyperLight"), creator of the TFLN Chiplet(TM) Platform, today announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) ...

Multi-die design teams should adopt modular principles, utilize proven IP blocks with D2D support, and implement automated integration tools.

Why chiplets and why now? A special section at EDN provides a detailed treatment of this revolutionary silicon technology ...

HyperLight Corporation (“HyperLight”) today announced a major milestone in low-power optical networking with the demonstration of a 1.6T-DR8 optical transceiver leveraging HyperLight’s TFLN Chiplet™ ...

A new technical paper, “Link Quality Aware Pathfinding for Chiplet Interconnects,” was published by researchers at UCLA. Abstract “As chiplet-based integration advances, designers must select among ...

TIER IV, the pioneering force behind open-source software for autonomous driving, has officially joined the Automotive Chiplet Program (ACP) overseen by imec, a world-leading research and innovation ...

For decades, monolithic system-on-chip (“SoC”) designs defined the semiconductor landscape. Introduced in the 1970s[1] and refined over several generations, SoCs allowed designers to integrate ...

The awards spotlight application acceleration, packaging, die-to-die interfaces, and other key technical areas. Chiplet Summit, the premier global event focused on chiplet-based design and integration ...

SANTA CLARA, Calif., February 02, 2026--(BUSINESS WIRE)--Chiplet Summit, the biggest conference totally dedicated to chiplets, today announced the keynotes for its fourth annual event, February 17-19, ...

Chiplet Summit, the biggest chiplet show ever, announces its pre-conference day schedule. It will occur on Tuesday, February 17, at the Santa Clara Convention Center, ahead of the main event taking ...

Eliyan Corp., a startup developing technology for building chiplet-based processors, today announced that it has closed a $40 million funding round. The Series A round was led by Tracker Capital.