SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the tapeout of Cadence ® 16G UCIe™ 2.5D advanced package IP on TSMC’s 3nm (N3E) process technology.

The state-of-the-art topside cooling (GTPAK™) and gull-wing (GLPAK™) packages meet increased performance and robust environmental demands State-of-the-art topside cooling (GTPAK™) and gull-wing ...

HSINCHU, Taiwan--(BUSINESS WIRE)--Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the launch of its 2.5D/3D advanced package service. With ...

Alpha and Omega Semiconductor Ltd. (AOS) has introduced two advanced surface-mount package options for its high power MOSFET portfolio. Designed to meet the packaging requirements for the most ...

SUNNYVALE, Calif.--(BUSINESS WIRE)-- Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of IDE 2.0, a ...

Variation is becoming increasingly problematic as chip designs become more heterogeneous and targeted by application, making it difficult to identify the root cause of problems or predict what can go ...

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

Digital lithography technology (DLT) is promising chipmakers to combine chips with submicron wiring on glass and other large substrates. And this maskless technology is at the center of a strategic ...