DUBLIN--(BUSINESS WIRE)--Research and Markets has announced the addition of the "Automated Optical Inspection System Market by Type (2D AOI Systems, 3D AOI Systems), Technology, Element, Application ...

WESTBOROUGH, Mass.--(BUSINESS WIRE)--Kopin Corporation (NASDAQ: KOPN) a leading provider of application-specific optical systems and high-performance microdisplays for defense, enterprise, industrial, ...

In contrast to manual inspection by trained employees, the automatic visual inspection systems always work objectively based on individual criteria and are not influenced by the condition of the ...

Optical Gaging Products (OGP), a manufacturer of optical and precision multisensor metrology systems for industrial quality ...

In this interview, Tim Skunes from CyberOptics Corporation talks to AZoM about their 3D optical inspection technology, and how it can be used to solve challenges in SMT electronics manufacturing.

Driven by the continued decrease in the size of electronics packaging, combined with the increase in density, there is a critical need for highly accurate 3D inspection for defect detection. Using ...

Two new Omron automated optical inspection (AOI) systems have been released: the VT-Z600 and VT-S1040. The VT-Z600 is Omron’s fastest pre/post reflow AOI system. It features multi-direction and ...

Bruker announced today that it has already received more than $7 million in orders for its new Bruker SP9900+ high-throughput high density interconnect (HDI) substrate metrology system, and has begun ...

Stacking chips is making it far more difficult to find existing and latent defects, and to check for things like die shift, leftover particles from other processes, co-planarity of bumps, and adhesion ...

Product manager at VITRONIC, Markus Maurer, talks to AZoM about the key advantages of automated camera-based optical seam inspection. Founded in 1984, VITRONIC today is a global market leader in ...

Packaging advances are driving innovation at KLA-Tencor, which in May announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830. Designed for ...