A new technical paper titled “3D integration of pixel readout chips using Through-Silicon-Vias” was published by researchers at CERN, IZM Fraunhofer and University of Geneva. “Particle tracking and ...
TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry's first 12-layer 3D-TSV ...
Leti, the next-generation chip stacking will be a key enabler for More-Than-Moore devices and applications, going forward ...
The steady march toward 3D ICs, namely mixed-signal or multi-technology systems-on-chip (SoC) or systems-in-package (SiP), is becoming a brisk jog. With a mix of military and government funding, and ...
Early-stage disease diagnosis relies on the highly sensitive detection of biomarkers. Optical whispering-gallery-mode (WGM) microcavity sensors have emerged as a highly promising technology for ...
HSINCHU, July 15, 2025 /PRNewswire/ -- InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced ...
A new technical paper titled “Co-Optimization of Power Delivery Network Design for 3D Heterogeneous Integration of RRAM-based Compute In-Memory Accelerators” was published by researchers at Georgia ...
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