In this video, we introduce the fundamentals of kinematics in 2D, focusing on projectile motion. Learn how to break down the horizontal and vertical components of motion, apply key equations, and ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

Silicon-based electronics are approaching their physical limitations and new materials are needed to keep up with current technological demands. Two-dimensional (2D) materials have a rich array of ...

Flat materials that can morph into three-dimensional shapes have potential applications in architecture, medicine, robotics, space travel, and much more. But programming these shape changes requires ...